



AOI checks placement and solder results. SPI checks solder paste after printing. This guide helps you choose the right inspection mix for your SMT line.
You’ve probably heard this in a meeting: “We need AOI.”
Then someone else says: “No, SPI first.”
Both people might be right. They’re just looking at different failure points.
Think of your SMT line like a 冷蔵室. You don’t fix chaos by adding one more shelf. You fix it by putting the right layer in the right place, so product flows clean and nothing falls behind the racks. That’s the mindset you want for inspection too.
You don’t buy inspection to “see defects.”
You buy it to stop three ugly things:
And yes, you also buy it to calm down the daily drama: false calls, finger-pointing, and that one operator who “knows by feel.”
SPI and AOI both help, but they help at different time. Pick the wrong one first, and you’ll still suffer.
SPI means Solder Paste Inspection. It checks your paste deposits right after printing.
If your paste is off, everything downstream gets weird. Placement can look fine, but the solder joint won’t.
Most modern SPI focuses on a few core checks:
You don’t need to obsess over every chart. You just need stable prints.
SPI shines when your pain starts at print:
SPI works like a “gate” before placement. It stops bad paste from turning into bad solder joints.

AOI means Automated Optical Inspection. It uses cameras (and sometimes 3D tech) to check parts and solder results.
AOI can sit in two common spots, and that changes what it’s good at.
Pre-reflow AOI checks boards after placement そして before the oven.
This is where it saves you from the dumb, expensive mistakes:
People like it because it prevents “baking in” a bad build. Once a board goes thru reflow, fixes get harder and slower.
Post-reflow AOI checks after reflow, so it can catch:
Here’s the catch: AOI can’t see everything.
For example, hidden joints under some packages can stay invisible. That’s when teams talk about AXI, but that’s another topic.
| 項目 | SPI (Solder Paste Inspection) | AOI (Automated Optical Inspection) |
|---|---|---|
| Typical location | After printer | After placement (pre-reflow) and/or after reflow |
| Best at catching | Print defects (paste volume/height/offset) | Placement errors and visible solder/assembly defects |
| Stops problems when | Before parts go down | Before oven (placement) or after oven (solder result) |
| Common “line pain” solved | Random opens, bridges tied to printing | Missing parts, polarity errors, rotation, post-reflow defects |
| Risk if you skip it | You chase ghosts later | You ship escapes or drown in rework |
If your defect data screams “printer,” SPI is the fast win.
If your defect data screams “placement mistakes,” AOI feels like oxygen.

Don’t pick tools based on what a vendor demo looks like. Pick based on your top recurring fails.
If you run lots of SKUs and quick changeovers, you need fast feedback.
High-mix lines usually end up with both, because the changeover risk is just… alot.
If you chase FPY (first pass yield) every day, think about “where defects start.”
When you build small stuff (fine pitch, tiny passives), your window shrinks.
This is why engineers stop arguing and run a layered setup.
If you can only buy one tool today, pick the one that hits your biggest failure bucket.
But if you’re building a “grown-up” line, layering wins.
Here’s a clean way to think about it.
| Process step | Tool | What you check | What you do next |
|---|---|---|---|
| Printing | スパイク | Paste volume/height/offset/shape | Adjust printer, stencil wipe, alignment |
| Placement | AOI (pre-reflow) | Missing, polarity, rotation, offset, coplanarity | Fix program, feeders, nozzles, pick height |
| Reflow result | AOI (post-reflow) | Bridges, tombstone, visible opens, solder quality | Tune profile window, confirm paste + place stability |
The big value isn’t “more inspection.”
The big value is faster root cause with less yelling.
A practical tip: build a “golden board” routine (a known-good reference). It reduces false calls and saves your sanity. Dont skip that step.

A cold room works best when storage stays organized and repeatable.
That’s why multilayer wire shelving exists. You add layers, but each layer has a purpose: airflow, access, load handling, and clean zoning.
It’s the same logic for inspection:
If you’re building cold storage systems, you already understand layered design.
That’s exactly what we build on the hardware side too. We do custom ODM & OEM work, so you can bring drawings or let us design around your workflow. If you’re planning cold room storage projects, this category page shows the idea of modular layers and real use cases: 冷蔵室多層ワイヤー棚.
And if your project touches broader cold-chain parts, you can also look at 冷凍庫部品 そして 冷凍ユニット部品. For airflow and protection panels, teams often pair shelving with リアメッシュ. If you need a build-to-spec program, start from our OEM/ODMサービス. If you’re speccing a full ワイヤーシェルフ lineup across SKUs, it helps to keep the system consistent.
One more thing: when teams ask for “fewer surprises,” they usually want two things—stable quality and stable supply. That’s where QIAO fits in naturally. It’s the same promise: reduce variation, keep the output consistent, and make scaling less painful.
Use this simple filter:
If you want, tell me your top 3 defect types (like “tombstone, bridge, polarity”). I’ll map them to an SPI/AOI setup and a no-drama action plan.