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Comparing Brands Of SMT Inspection Systems: Koh Young vs Mirtec vs Others

Compare Koh Young, Mirtec, and other SMT inspection systems with real shop-floor tests: defect coverage, 3D methods, programming speed, data links, and smoother line flow.

You can spend weeks arguing about brands. You can watch ten demos. You can still buy the “wrong” system for your line.

So let’s flip it.

If you want fewer escapes, less rework, and less line drama, you should compare problems, not logos. Then you match the tool to your real scenes: shiny parts, tight pitches, mixed models, rushed changeovers, and new operators at 2 a.m.

Below is a practical way to compare Koh Young vs Mirtec vs others (Viscom, Omron, Saki, Nordson, TRI, etc.). I’ll keep it simple and shop-floor friendly. I’ll also tie it back to how you run the area around inspection—because storage and flow matters more than people admit. That’s where リア・ワイヤーシェルビング helps, and where チアオ can fit naturally.


Defect Coverage and Process Step: SPI vs AOI vs AXI

Before you compare any brand, ask one question:

What defect are you trying to catch, and when?

  • SPI (Solder Paste Inspection) helps you stop defects early. You care about paste volume, height, area, and offset.
  • AOI (Automated Optical Inspection) catches placement and solder appearance issues: missing parts, polarity, tombstoning, bridging, lifted lead, bad fillet, and so on.
  • AXI / CT is for what optics can’t see (like inside BGA joints). Many factories don’t need it on every line. Some do.

If your pain is “bridges after reflow,” don’t over-weight SPI features. If your pain is “random opens on fine pitch,” you probably need strong SPI + process control, not just prettier AOI images.

実際の現場 You run a mixed-model line. One product uses tiny passives. Another uses big connectors. Your defect list changes every hour. You need a system that stays stable across that mess.


3D Measurement Methods: Profilometry, Moiré, Structured Light

People say “3D” like it’s one thing. It isn’t.

Vendors use different 3D approaches. The method affects what you feel every day:

  • How it handles shiny parts そして glare
  • How it sees side solder そして tall parts
  • How often you fight false calls (nuisance alarms)

Here’s the practical take:

  • Some systems lean on 3D shape measurement to reduce “looks like a defect” noise.
  • Some systems use Moiré / fringe patterns to measure height fast across a field.
  • Some systems use multi-angle cameras to “peek” around leads and edges.

実際の現場 Your board has metal shields and glossy IC tops. A basic 2D setup can panic. A stronger 3D/lighting strategy stays calmer. That calm saves you time, because you don’t keep re-checking good boards again and again.

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Programming and Changeover: Offline Programming, CAD/Gerber, Libraries

In many factories, the biggest cost isn’t the machine. It’s the time you lose while you “teach” it.

So compare this first:

  • Can you do offline programming while the line keeps running?
  • Can you import CAD/Gerber data to speed setup?
  • Do you get reusable component libraries that don’t fall apart?

If you run high-mix, this matters more than raw speed. Even if a machine is fast, it feels slow when you spend hours tuning windows, thresholds, and part definitions.

実際の現場 You swap to a new PCB revision. Pads move a little. Silkscreen changes. Half your rules break. The best system is the one that gets you back to stable inspection with less babysitting.


Throughput, Resolution, and Field of View: Don’t Read One Number

Specs can trick you. Vendors might highlight one number that looks amazing, but it hides trade-offs.

When you compare brands, keep these three together:

  • スループット (how much area per second it can scan)
  • Resolution (how fine the pixel/measurement is)
  • FOV (field of view per shot)

A wider FOV can reduce moves, which helps speed. A finer resolution can catch tiny issues, but it can slow the scan. You want a balance that matches your board density and takt time.

Also watch the “fine print” that never says fine print:

  • speed may assume certain camera option
  • speed may assume certain board coverage
  • speed may ignore review station time (the human part)
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Data Connectivity: Hermes, IPC-CFX, MES, Closed-Loop Feedback

Modern inspection isn’t just pass/fail. It’s data you can act on.

If you already use MES or plan to, compare:

  • Can it speak ヘルメス and/or IPC-CFX cleanly?
  • Can it send results fast enough for real decisions?
  • Can it support closed-loop feedback (like paste printer adjustments from SPI trends)?

実際の現場 Your line builds up small drift. Paste volume slowly drops. If SPI trends trigger a correction early, you avoid a pile of rework later. You don’t need magic. You need data flow that actually works on your floor.


Quick Comparison Table: What To Look At (Koh Young, Mirtec, Others)

Note: numbers vary by model and options, so use this as a decision guide, not a promise sheet.

Comparison LensWhat You’re Really TestingKoh Young (typical positioning)Mirtec (typical positioning)Others (Viscom / Omron / Saki / Nordson / TRI, etc.)
Defect focusWhat defects it catches reliablyStrong 3D strategy, stable detection logicGood 2D/3D options, often flexible for teamsVaries: some push speed, some push multi-angle, some push metrology
3D methodHow it measures height/shapeTrue 3D shape measurement focusMoiré-style 3D in some linesStructured light / multi-angle / reflection control (depends)
Lighting + glare controlHow it behaves on shiny partsOften strong hereCan be strong, depends configSome brands really specialize in reflection suppression
Programming flowChangeover speed in real lifeCAD/Gerber driven workflows often emphasizedUsability varies by model/software packageSome have very strong offline programming tools
Speed vs detailDoes it meet takt time without losing sensitivityBalanced approachCan be very competitive in scan speed by modelSome are extremely fast, some are extremely detailed
Data integrationHermes/CFX/MES readinessUsually supports factory data approachOften supported via optionsTRI and others may emphasize smart factory standards strongly
製氷機リア・メッシュ

Where Rear Wire Shelving Helps Your SMT Inspection Area

People think inspection problems come from optics only. But many problems come from messy flow:

  • wrong reel ends up at AOI review desk
  • golden board sits in a drawer and gets scratched
  • calibration artifacts get mixed with random tools
  • operators waste time walking for fixtures, nozzles, feeders, labels

それが理由だ。 リア・ワイヤーシェルビング can quietly make inspection smoother.

Here’s how teams use it in real world:

  • AOI/SPI “library wall”: labeled bins for golden boards, setup checklists, sample defect boards.
  • Review station staging: trays for “Hold / Recheck / MRB” boards, so nothing disappears.
  • Metrology corner: clean storage for calibration plates, gauge blocks, camera covers, and spare lenses.
  • ESD-friendly organization: add mats, grounding points, and clear labeling zones (you set the rules).

If you run OEM/ODM work, you know every customer wants their own labeling and storage style. That’s why custom shelving matters. You can build the storage around the process, not the other way around.

At wireshelvingmfg.com, the point isn’t “a shelf.” The point is カスタムワイヤシェルフ: you bring a layout, or we help design it. You pick corrosion-resistant finishes, build for labs or warehouse, and ship globally with ISO quality habits. That keeps your inspection zone clean and repeatable, even when production is chaotic.

I also like to say it plain: if your business sells 冷凍庫部品 そして カスタマイズ製品, your factory already lives in high-mix reality. Your inspection flow should match that reality, not fight it.


If you need custom リアメッシュ and rear wire shelving for the inspection area, チアオ can support OEM/ODM builds based on your drawings or your line layout.


A Simple Demo Script: How You Compare Brands Without Getting Fooled

Bring the same “pain boards” to every demo. Don’t bring easy boards only.

テストWhat You BringWhat You Measure
Shiny parts testBoard with shields, glossy ICsFalse call rate and review time
Fine pitch testTight pitch QFP/QFN, small passivesEscapes, repeatability, re-check effort
Mixed model changeoverTwo products with different rulesSetup time, library reuse, stability
Data testA simple traceability needCan you export results cleanly, fast
Operator testNew operator runs itHow many “gotcha” steps happen

Don’t chase perfect slides. Chase less chaos on Monday morning.


Closing: Pick The System That Fits Your Line, Then Support It Like A System

Koh Young, Mirtec, and the other big names all make capable tools. The “best” one depends on your defect mix, your board surfaces, your changeover pace, and your data plan.

Do this and you’ll pick smarter:

  1. compare defect coverage by process step
  2. look hard at the 3D method and glare behavior
  3. treat programming and changeover like a first-class metric
  4. check data connectivity before you need it
  5. build a clean inspection area with the right storage flow (Rear Wire Shelving helps a lot)
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